JPS6127183Y2 - - Google Patents
Info
- Publication number
- JPS6127183Y2 JPS6127183Y2 JP11207781U JP11207781U JPS6127183Y2 JP S6127183 Y2 JPS6127183 Y2 JP S6127183Y2 JP 11207781 U JP11207781 U JP 11207781U JP 11207781 U JP11207781 U JP 11207781U JP S6127183 Y2 JPS6127183 Y2 JP S6127183Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- packages
- connector part
- leads
- convex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11207781U JPS5818346U (ja) | 1981-07-27 | 1981-07-27 | Icパツケ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11207781U JPS5818346U (ja) | 1981-07-27 | 1981-07-27 | Icパツケ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5818346U JPS5818346U (ja) | 1983-02-04 |
JPS6127183Y2 true JPS6127183Y2 (en]) | 1986-08-13 |
Family
ID=29906418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11207781U Granted JPS5818346U (ja) | 1981-07-27 | 1981-07-27 | Icパツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5818346U (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2794972B2 (ja) * | 1991-03-12 | 1998-09-10 | イビデン株式会社 | リードレスチップキャリア |
-
1981
- 1981-07-27 JP JP11207781U patent/JPS5818346U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5818346U (ja) | 1983-02-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4905124A (en) | IC card | |
US4540226A (en) | Intelligent electronic connection socket | |
JPH1168026A (ja) | 配線用補助パッケージおよび印刷回路配線板構造 | |
KR100246587B1 (ko) | 볼 그리드 어레이 반도체 팩키지 | |
JPS6127183Y2 (en]) | ||
US4661653A (en) | Package assembly for semiconductor device | |
KR970004541B1 (ko) | 메모리카드 | |
JPS6251501B2 (en]) | ||
JPH0567070B2 (en]) | ||
JPS6020932Y2 (ja) | 半導体装置 | |
JPH0439668Y2 (en]) | ||
KR102616022B1 (ko) | 광학센서 패키지 | |
KR20010018945A (ko) | 반도체패키지 | |
KR200233845Y1 (ko) | 적층형 비지에이 반도체 패키지 및 그 제조방법 | |
KR100280393B1 (ko) | 반도체 패키지 | |
JP2788196B2 (ja) | Icカード用ic基板 | |
JPS635233Y2 (en]) | ||
JPH04118958A (ja) | 表面実装用多層型配線基板 | |
JP2589641Y2 (ja) | 混成集積回路装置 | |
JP4591816B2 (ja) | 半導体装置 | |
JPH0567859A (ja) | Icの実装方法 | |
JP2550477B2 (ja) | メモリ装置用部品取付板およびメモリユニット | |
JP4591816B6 (ja) | 半導体装置 | |
JPS62201941U (en]) | ||
JPH03236245A (ja) | 半導体装置 |